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PTFA212001F - Thermally-Enhanced High Power RF LDMOS FET

Download the PTFA212001F datasheet PDF. This datasheet also covers the PTFA212001E variant, as both devices belong to the same thermally-enhanced high power rf ldmos fet family and are provided as variant models within a single manufacturer datasheet.

Description

The PTFA212001E and PTFA212001F are 200-watt LDMOS FETs designed for single- and two-carrier WCDMA power amplifier applications in the 2110 to 2170 MHz band.

Features

  • include input and output matching, and thermally-enhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA212001E Package H-36260-2 PTFA212001F Package H-37260-2 PTFA212001E PTFA212001F IM3 (dBc), ACPR (dBc) Drain Efficiency (%) 2-Carrier WCDMA Drive-up VDD = 30 V, IDQ = 1600 mA, ƒ = 2140 MHz, 3GPP WCDMA signal, P/A R = 8 dB, 10 MHz carrier spacing -23 30 -28 Eff.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PTFA212001E-Infineon.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number PTFA212001F
Manufacturer Infineon
File Size 391.34 KB
Description Thermally-Enhanced High Power RF LDMOS FET
Datasheet download datasheet PTFA212001F Datasheet

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Other Datasheets by Infineon

Part Number Description
PTFA212001E Thermally-Enhanced High Power RF LDMOS FET
PTFA212002E Thermally-Enhanced High Power RF LDMOS FET
PTFA212401E Thermally-Enhanced High Power RF LDMOS FET
PTFA212401F Thermally-Enhanced High Power RF LDMOS FET
PTFA210301E Thermally-Enhanced High Power RF LDMOS FET

Full PDF Text Transcription

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Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FETs 200 W, 2110 – 2170 MHz Description The PTFA212001E and PTFA212001F are 200-watt LDMOS FETs designed for single- and two-carrier WCDMA power amplifier applications in the 2110 to 2170 MHz band. Features include input and output matching, and thermally-enhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability.
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