IDC05S60CE
Features
: Revolutionary semiconductor material Silicon Carbide
- Switching behavior benchmark
- No reverse recovery
- No temperature influence on the switching behavior
- No forward recovery ..net
- High surge current capability
- Applications:
- SMPS, PFC, snubber
Chip Type
VBR 600V
IF 5A
Die Size 1.45 x 1.162 mm2
Package sawn on foil
Mechanical Parameter Raster size Anode pad size Area total Thickness Wafer size Max. possible chips per wafer Passivation frontside Anode metal Cathode metal Die bond Wire bond Reject ink dot size Remended storage environment 1.45x 1.162 1.213 x 0.925 1.68 355 100 4051 Photoimide 3200 nm Al Ni Ag
- system suitable for epoxy and soft solder die bonding Electrically conductive glue or solder Al, ≤ 350µm ∅ ≥ 0.3 mm Store in original container, in dry nitrogen, in dark environment, < 6 month at an ambient temperature of 23°C µm mm mm2
Edited by INFINEON Technologies, AIM IMM, Edition 1.1, 27.01.2009
Maximum Ratings Parameter...
