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IXXH75N60B3 - Extreme Light Punch Through IGBT

Features

  • z Optimized for 5-30kHz Switching z Square RBSOA z Avalanche Capability z Short Circuit Capability z International Standard Package Advantages z High Power Density z 175°C Rated z Extremely Rugged z Low Gate Drive Requirement.

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Full PDF Text Transcription

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Advance Technical Information XPTTM 600V IGBT GenX3TM Extreme Light Punch Through IGBT for 5-30 kHz Switching IXXH75N60B3 VCES = IC110 = V ≤ CE(sat) tfi(typ) = 600V 75A 1.85V 125ns Symbol VCES VCGR VGES VGEM IC25 IC110 ICM IA EAS SSOA (RBSOA) tsc (SCSOA) PC TJ TJM Tstg TL TSOLD Md Weight Test Conditions TJ = 25°C to 175°C TJ = 25°C to 175°C, RGE = 1MΩ Continuous Transient TC = 25°C TC = 110°C TC = 25°C, 1ms TC = 25°C TC = 25°C VGE = 15V, TVJ = 150°C, RG = 5Ω Clamped Inductive Load VGE= 15V, VCE = 360V, TJ = 150°C RG = 22Ω, Non Repetitive TC = 25°C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s Mounting Torque Maximum Ratings 600 V 600 V ±20 V ±30 V 160 A 75 A 300 A 30 A 500 mJ ICM = 150 A ≤ @VCE VCES 10 μs 750 -55 ...
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