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IXGP7N60BD1 - HiPerFAST IGBT

Download the IXGP7N60BD1 datasheet PDF. This datasheet also covers the IXGA7N60BD1 variant, as both devices belong to the same hiperfast igbt family and are provided as variant models within a single manufacturer datasheet.

Features

  • G = Gate, E = Emitter, C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md www. DataSheet4U. net.
  • International standard packages 0.45/4 Nm/lb. in. 0.55/5 Nm/lb. in. 4 2 g g JEDEC TO-263 surface mountable and JEDEC TO-220 AB.
  • High current handling capability.
  • HiPerFASTTM.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IXGA7N60BD1_IXYSCorporation.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription

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Advanced Technical Information HiPerFASTTM IGBT with Diode IXGA 7N60BD1 IXGP 7N60BD1 VCES IC25 VCE(sat) tfi = 600 V = 14 A = 2.0 V = 150ns Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 18 Ω Clamped inductive load @ 0.8 VCES TC = 25°C Maximum Ratings 600 600 ±20 ±30 14 7 56 ICM = 14 80 -55 ... +150 150 -55 ... +150 300 M3 M3.5 V V V V A A A A G E C (TAB) G C E TO-220AB (IXGP) TO-263 AA (IXGA) W °C °C °C °C Features G = Gate, E = Emitter, C = Collector, TAB = Collector Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md www.DataSheet4U.net • International standard packages 0.
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