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PZ5032-10A44 - 32 Macrocell PLD

Description

Assembly Die Process ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process TABLES Procedure Overall Quality Evaluation Package Markings Wirebond Strength Die Material Analysis Horizontal Dimensions Vertical Dimensions PAGE 1 1 2 2-3 4 5-7 8 9 10 10 10 11 12 -iFree Datasheet http://www.Da

Features

  • Twin-well CMOS process in an N substrate (no epi).
  • Sub-micron gate lengths (0.35 micron N-channel and 0.4 micron P-channel).
  • Tungsten plugs used under all metal layers. 1These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended.

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Datasheet Details

Part number PZ5032-10A44
Manufacturer INTEGRATED CIRCUIT ENGINEERING
File Size 5.50 MB
Description 32 Macrocell PLD
Datasheet download datasheet PZ5032-10A44 Datasheet

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Full PDF Text Transcription

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Construction Analysis Philips PZ5032-10A44 32 Macrocell PLD Report Number: SCA 9611-501 ® INTEGRATED CIRCUIT ENGINEERING CORPORATION 15022 N. 75th Street • Scottsdale, AZ 85260-2476 Telephone: 602-998-9780 • Fax: 602-948-1925 Free Datasheet http://www.Datasheet4U.com INDEX TO TEXT TITLE INTRODUCTION MAJOR FINDINGS TECHNOLOGY DESCRIPTION Assembly Die Process ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process TABLES Procedure Overall Quality Evaluation Package Markings Wirebond Strength Die Material Analysis Horizontal Dimensions Vertical Dimensions PAGE 1 1 2 2-3 4 5-7 8 9 10 10 10 11 12 -iFree Datasheet http://www.Datasheet4U.com INTRODUCTION This report describes a construction analysis of the Philips PZ5032-10A44 32 macrocell CPLD.
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