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H9CCNNN8JTALAR - 8Gb LPDDR3

Description

and is subject to change without notice.

for use of circuits described.

No patent licenses are implied.

Features

  • [ FBGA ].
  • Operation Temperature - (-30)oC ~ 85oC.
  • Package - 178-ball FBGA - 11.0x11.5mm2, 1.00t, 0.65mm pitch - Lead & Halogen Free [ LPDDR3 ].
  • VDD1 = 1.8V (1.7V to 1.95V).
  • VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30).
  • HSUL_12 interface (High Speed Unterminated Logic 1.2V).
  • Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock - CS_n, CKE latched at rising edge.

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Full PDF Text Transcription

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178ball FBGA Specification 8Gb LPDDR3 (x32, 2CS) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.0 / Apr. 2014 1 Document Title FBGA 8Gb (x32, 2CS) LPDDR3 Revision History Revision No. History 0.1 - Initial Draft for Internal Review 0.2 - Updated Ordering Information and IDD specification - Editorial Changes 0.3 - Corrected Operating temperature 1.0 Final Version - Updated Input/Output Capacitance H9CCNNN8JTALAR LPDDR3 8Gb(x32, 2CS) Draft Date Mar. 2013 Remark Preliminary Apr. 2014 Preliminary Apr. 2014 Preliminary Apr. 2014 Rev 1.0 / Apr.
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