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HY27US561M - 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash

Description

of Device Operations - /CE Don’t Care Enabled(Disabled) -> Sequential Row Read Disabled(Enabled) (Page23) 1) change FBGA dimension : Thickness : 1.2mm(max) -> 1.0mm(max) 2) Edit Fig.33 read operation with CE don't care 1) Change TSOP1,WSOP1,FBGA package dimension 0.6 - Change TSOP1,WSOP1,FBGA mechan

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Datasheet Details

Part number HY27US561M
Manufacturer SK Hynix
File Size 786.15 KB
Description 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash
Datasheet download datasheet HY27US561M Datasheet

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HY27SS(08/16)561M Series HY27US(08/16)561M Series 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash Document Title 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash Memory Revision History No. 0.0 0.1 Initial Draft Renewal Product Group History Draft Date Jul. 10. 2003 Dec. 08. 2003 Dec. 08. 2003 Remark Preliminary Preliminary Preliminary 0.2 Append 1.8V Operation Product to Data sheet www.DataSheet4U.com Insert Spare Enable function for GND Pin(#6) - In case of Reading or Programming, GND Pin(#6) should be Low or High. - Change the test condition of Stand-by current-Refer to Table 13. Change CSP Package name & thickness - Name : VFBGA -> FBGA - Thickness : 1.0mm(max) -> 1.
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