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QSB363 - SUBMINIATURE PLASTIC SILICON INFRARED PHOTOTRANSISTOR

Description

The QSB363 is a silicon phototransistor encapsulated in a black infrared transparent T-3/4 package.

Features

  • NPN Silicon Phototransistor.
  • T-3/4 (2mm) Surface Mount Package.
  • Medium Wide Beam Angle, 24°.
  • Black Plastic Package.
  • Matched Emitters: QEB363 or QEB373.
  • Daylight Filter.
  • Tape & Reel Option (See Tape & Reel Specifications).
  • Lead Form Options: Gullwing, Yoke, Z-Bend  2001 Fairchild Semiconductor Corporation DS300357 8/2/01 1 OF 5 www. fairchildsemi. com.

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Full PDF Text Transcription

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SUBMINIATURE PLASTIC SILICON INFRARED PHOTOTRANSISTOR QSB363 PACKAGE DIMENSIONS EMITTER 0.276 (7.0) MIN 0.087 (2.2) 0.071 (1.8) 0.024 (0.6) 0.016 (0.4) 0.074 (1.9) 0.019 (0.5) 0.012 (0.3) .118 (3.0) .102 (2.6) .059 (1.5) .051 (1.3) 0.055 (1.4) SCHEMATIC COLLECTOR 0.008 (0.21) 0.004 (0.11) 0.106 (2.7) 0.091 (2.3) 0.024 (0.6) NOTES: 1. Dimensions are in inches (mm). 2. Tolerance of ± .010 (.25) on all non nominal dimensions unless otherwise specified. EMITTER DESCRIPTION The QSB363 is a silicon phototransistor encapsulated in a black infrared transparent T-3/4 package.
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