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SPECIFICATION FOR APPROVAL
REF : 20090828-C PROD. NAME ABC'S DWG NO. SW1608□□□□L□-□□□ PAGE: 1
WOUND CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A A B B C D E F G C H I E F E H I G I ( PCB Pattern )
D
:
1.60±0.2
m/m m/m m/m m/m m/m m/m m/m m/m m/m
: 1.05±0.2 : 1.05±0.2 : 0.50 : 0.35 : 0.90 : : : 0.70 1.20 0.45
Ⅱ﹒SCHEMATIC DIAGRAM：
d
www.DataSheet4U.com Ⅲ﹒MATERIALS：
a
a﹒Core：Ceramic b﹒WIRE ：Enamelled copper wire (class H) c﹒Terminal：Mo / Mn + Ni + Au d﹒Encapsulate：Epoxy e﹒Remark：Products comply with RoHS' requirements c
Peak Temp： 260 ℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max.
Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max.
SW1608xxxxLx-xxx Datasheet
