NP352 Datasheet (Yamaichi) - Fine Ball Grid Array

NP352, Fine Ball Grid Array

NP352 Series (Open Top) Fine Ball Grid Array (FBGA, 1.00mm Pitch) Specifications Insulation Resistance: 1,000MW min.

at 100V DC Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 100mW max.

at 10mA/20mV max.

Operating Temperature Range: 40°C to +150°C / -55°C to +150°C Contact Force: 15g per pin approx.

Mating Cycles: 10,000 insertions minimun Part Number (Details) NP352 - 560 09 - - Series No.

No.

of Contact Pins Design Number Materials a

NP352 Features

* í Open top type sockets with "Tweezer Style Contacts" For FBGA packages í Secure package alignment due to self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls Outline Base Socket Dimensio