NP352 - Fine Ball Grid Array

Datasheet Details

í Open top type sockets with "Tweezer Style Contacts" For FBGA packages í Secure package alignment due to self contacting structure without upper pressing force (ZIF) í Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls Outline Base Socket Dimensions A±0.4 B±0.4 Yamaichi's 2-point Tweezer Contact IC Ball Socket Base A Contacts Socket Base B Since the solder balls are touched by two contacts on each side, the solder ball damage can be minimi.

📁 NP352 Similar Datasheet

Other Datasheets by Yamaichi

Published: Nov 20, 2015 |