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TGA9083-EEU Power Amplifier

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Description

T R I Q U I N T S E M I C O N D U C T O R , I N C .TGA9083-EEU Power Amplifier q q q q q q q PHOTO ENLARGEMENT 6.5 to 11.5- .
11.

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Applications

* such as point-to-point radio , phased-array radar, and telecommunications. Bond pad and backside metallization is gold plated for compa tibility with eutectic alloy attachment methods as well as with thermocompression and thermosonic wire -bonding processes. The TGA9083 - EEU is supplied in chip for

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