Datasheet Specifications
- Part number
- THGBMHG7C1LBAIL
- Manufacturer
- Toshiba ↗
- File Size
- 0.99 MB
- Datasheet
- THGBMHG7C1LBAIL-Toshiba.pdf
- Description
- 16GB density of e-MMC Module
Description
THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball B.
Features
* THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NTHGBMHG7C1LBAIL Distributors
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