Datasheet Details
- Part number
- THGBMHG7C1LBAIL
- Manufacturer
- Toshiba ↗
- File Size
- 0.99 MB
- Datasheet
- THGBMHG7C1LBAIL-Toshiba.pdf
- Description
- 16GB density of e-MMC Module
THGBMHG7C1LBAIL Description
THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball B.
THGBMHG7C1LBAIL Features
* THGBMHG7C1LBAIL Interface
THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection
P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
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12 NC NC NC NC N
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