Datasheet Specifications
- Part number
- THGBMBG5D1KBAIL
- Manufacturer
- Toshiba ↗
- File Size
- 1.02 MB
- Datasheet
- THGBMBG5D1KBAIL-Toshiba.pdf
- Description
- 4GB density e-MMC
Description
THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA.
Features
* THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NTHGBMBG5D1KBAIL Distributors
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