Datasheet Specifications
- Part number
- THGBMDG5D1LBAIL
- Manufacturer
- Toshiba ↗
- File Size
- 1.16 MB
- Datasheet
- THGBMDG5D1LBAIL-Toshiba.pdf
- Description
- e-MMC Module
Description
THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BG.
Features
* THGBMDG5D1LBAIL Interface THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NTHGBMDG5D1LBAIL Distributors
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