Description
Green compound Green compound
Document Number: DS_S1404015
Version: A14
Small Signal Product
PACKAGE OUTLINE DIMENSIONS SOD-323
B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
DIM.A B C D E F G H
Unit (mm) Min Max 1.15 1.40 2.30 2.70 0.25 0.45 1.60 1.80 0.80 1.00 0.05 0.17
0.475 REF - 0.10
Unit (inch) Min Max 0.045 0.055 0.091 0.106 0.010 0.018 0.063 0.071 0.031 0.039 0.002 0.007
0.19 REF - 0.004
SUGGESTED PAD LAYOUT
DIM.A B C D
Unit (mm) Typ.0.63 0.83 1.60 2.86
Unit (inch) Typ.0.025
Features
- - Low Forward Voltage Drop - Surface mount device type - Moisture sensitivity level 1 - Pb free and RoHS compliant.