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K4N56163QF-GC 256Mbit gDDR2 SDRAM

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Description

K4N56163QF-GC 256M gDDR2 SDRAM 256Mbit gDDR2 SDRAM Revision 2.0 October 2005 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG.
FOR 4M x 16Bit x 4 Bank gDDR2 SDRAM The 256Mb gDDR2 SDRAM chip is organized as 4Mbit x 16 I/O x 4banks banks device.

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Datasheet Specifications

Part number
K4N56163QF-GC
Manufacturer
Samsung
File Size
1.37 MB
Datasheet
K4N56163QF-GC-Samsung.pdf
Description
256Mbit gDDR2 SDRAM

Features

* 1.8V + 0.1V power supply for device operation
* 1.8V + 0.1V power supply for I/O interface
* 4 Banks operation
* Posted CAS
* Programmable CAS Letency : 4,5,6 and 7
* Programmable Additive Latency : 0, 1, 2, 3. 4 and 5
* Write Latency (WL) =

Applications

* where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.

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