MR16R162GAF0 - (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die

Product Overview

Samsung semiconductor

Datasheet Details

Part number	MR16R162GAF0
Manufacturer	Samsung semiconductor
File Size	419.61 KB
Description	(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
Datasheet	MR16R162GAF0 Datasheet
Note	This datasheet PDF includes multiple part numbers: MR16R162GAF0, MR16R1622AF0. Please refer to the document for exact specifications by model.
Additional preview pages of the MR16R162GAF0 datasheet.

Product details

Description

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68, B70, B72, B74, B76, B78, B80, B82, B84, B86, B88, B90, B92 B10 B12 B34 A20, B20, A22, B22, A24 A14 A12 I I I I I I RSL RSL VCMOS RSL RSL RSL I/O Type Description Gnd Ground reference for RDRAM cor

Features

256M x 16/18 -CN9 -CM8 -CK8.
High speed up to 1066 MHz RDRAM storage.
184 edge connector pads with 1mm pad spacing.
Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module.
Module PCB size : 133.35mm x 34.93mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.375” x 0.05”) -.

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Other Datasheets by Samsung semiconductor

MR16R162GDF0 - (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1622AF0 - (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1622DF0 - (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624AF0 - (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
MR16R1624DF0 - (MR1xR1622(4/8/G)DF0) Key Timing Parameters
MR16R1624GEG0 - Key Timing Parameters

Published: Jan 19, 2006 |