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FBGA-SD - Fine Pitch Ball Grid Array

Product Overview

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FBGA-SD Fine Pitch Ball Grid Array by STATS ChipPAC - Datasheet Preview — Datasheet preview – FBGA-SD

Datasheet Details

Part number	FBGA-SD
Manufacturer	STATS ChipPAC
File Size	589.36 KB
Description	Fine Pitch Ball Grid Array
Datasheet	FBGA-SD_STATSChipPAC.pdf
Additional preview pages of the FBGA-SD datasheet.

Product details

Description

STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.

Features

2 die to 7 die stack with spacer capability.
5 x 5mm to 23 x 23mm body size.
Package height at 1.0, 1.2, 1.4 and 1.7mm max.
Flexible die stacking options (“pyramid,” “same die,” etc. ).
0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball.
Flash/SRAM/PSRAM/Logic/Analog combinations.
JEDEC standard package outlines.
Die thinning to 75um (3mils) capability.
Low loop wire bonding; reverse and die to die.

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Other Datasheets by STATS ChipPAC

FBGA - Fine Pitch Ball Grid Array

Published: Oct 17, 2007 |