FBGA - Fine Pitch Ball Grid Array

Product Overview

Datasheet Details

Part number	FBGA
Manufacturer	STATS ChipPAC
File Size	589.04 KB
Description	Fine Pitch Ball Grid Array
Datasheet	FBGA_STATSChipPAC.pdf
Additional preview pages of the FBGA datasheet.

Product details

Description

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.

Features

Thin, lightweight, space saving package.
Flexible body sizes range from 4mm x 4mm to 23mm x 23mm.
0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch.
Eutectic & Pb free solder balls.
Green package available.
Multiple routing layers and dedicated ground/power planes available for improved electrical performance.
BT laminate materials (2 and 4 metal layers).
JEDEC standard compliant.

📁 Similar Datasheet

FBGA96T.5-DC144 - FBGA96T.5-DC144 (TopLine)

Other Datasheets by STATS ChipPAC

FBGA-SD - Fine Pitch Ball Grid Array

Published: Oct 17, 2007 |