COP8SDE9, COP8SBE9 - (COP8SxE9) 8-Bit CMOS Flash Microcontroller

National Semiconductor

The COP8SDE9 by National Semiconductor is a (COP8SxE9) 8-Bit CMOS Flash Microcontroller. Below is the official datasheet preview.

Datasheet Details

Part number	COP8SDE9, COP8SBE9
Manufacturer	National Semiconductor
File Size	827.18 KB
Description	(COP8SxE9) 8-Bit CMOS Flash Microcontroller
Datasheet	COP8SBE9_NationalSemiconductor.pdf
Note	This datasheet PDF includes multiple part numbers: COP8SDE9, COP8SBE9. Please refer to the document for exact specifications by model.
Additional preview pages of the COP8SDE9 datasheet.

The COP8SBE9/SCE9/SDE9 Flash microcontrollers are highly integrated COP8™ Feature core devices, with 8k Flash memory and advanced

including Virtual EEPROM, High Speed Timers, USART, and Brownout Reset. Devices included in this datasheet: Device COP8SBE9 COP8SCE9 Flash Program Memory (bytes) 8k 8k RAM (bytes) 256 256 Brownout Voltage 2.7V to 2.9V 4.17V to 4.5V I/O Pins 37,39 37,39 Packages 44 LLP, 44PLCC, 48 TSSOP 44 LLP, 44PLCC, 48 TSSOP 44 LLP, 44 PLCC, 48 TSSOP Temperature 0˚C to +70˚C 0˚C to +70˚C.
40˚C to +125˚C 0˚C to +70˚C.
40˚C to +125˚C This single-chip CMOS device is suited for.

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Other Datasheets by National Semiconductor

COP8SDR9 - 8-Bit CMOS Flash Based Microcontroller with 32k Memory/ Virtual EEPROM and Brownout
COP8SA - 8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging
COP8SAA5 - 8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging
COP8SAA7 - 8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging
COP8SAB5 - 8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging
COP8SAB7 - 8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging

Published: Jan 25, 2010 |