Description
ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DATA General notes LIMITING VALUES CHARACTERISTICS TEST AND APPLICATION INFORMATION PACKAGE OUTLINE 12 12.1 12.2 12.3 12.4 12.5 13 14 15 SOLDERING
TZA1049
Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2004 Mar 09
2
Philips Semiconductors
Product speciļ¬cation
www.Data
TZA1049_PhilipsSemiconductors.pdf
