Description
4Ordering information 5Block diagram 6Pinning 7Functional data 7.1General notes 8Limiting values 9Characteristics 10Test and application information 11Package outline
TZA1048
12Soldering 12.1Introduction to soldering surface mount packages 12.2Reflow soldering 12.3Wave soldering 12.4Manual soldering 12.5Suitability of surface mount IC packages for wave and reflow soldering methods 13Data sheet status 14Definitions 15Disclaimers
2004 Mar 09
2
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Philips Semiconductors
Prod
Features
TZA1048_PhilipsSemiconductors.pdf
