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SL2ICS2001V1D, SL2ICS2001DW - I-CODE SLI Label IC bumped wafer specification on UV-tape

The SL2ICS2001V1D by NXP is a I-CODE SLI Label IC bumped wafer specification on UV-tape. Below is the official datasheet preview.

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Official preview page of the SL2ICS2001V1D I-CODE SLI Label IC bumped wafer specification on UV-tape datasheet (NXP).

Datasheet Details

Part number SL2ICS2001V1D, SL2ICS2001DW
Manufacturer NXP
File Size 160.53 KB
Description I-CODE SLI Label IC bumped wafer specification on UV-tape
Datasheet download datasheet SL2ICS2001DW_NXP.pdf
Note This datasheet PDF includes multiple part numbers: SL2ICS2001V1D, SL2ICS2001DW.
Please refer to the document for exact specifications by model.
Additional preview pages of the SL2ICS2001V1D datasheet.

SL2ICS2001V1D Product details

Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. Diameter: Thickness:

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