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SL2ICS2001DW - I-CODE SLI Label IC bumped wafer specification on UV-tape

The SL2ICS2001DW by NXP is a I-CODE SLI Label IC bumped wafer specification on UV-tape. Below is the official datasheet preview.

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Official preview page of the SL2ICS2001DW I-CODE SLI Label IC bumped wafer specification on UV-tape datasheet (NXP).

Datasheet Details

Part number SL2ICS2001DW
Manufacturer NXP
File Size 160.53 KB
Description I-CODE SLI Label IC bumped wafer specification on UV-tape
Datasheet download datasheet SL2ICS2001DW_NXP.pdf
Additional preview pages of the SL2ICS2001DW datasheet.

SL2ICS2001DW Product details

Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. Diameter: Thickness:

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