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BY228 - Damper diode

NXP

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Datasheet Details

Part number	BY228
Manufacturer	NXP
File Size	52.12 KB
Description	Damper diode
Datasheet	BY228_PhilipsSemiconductors.pdf

BY228 Product details

Description

Rugged glass package, using a high temperature alloyed construction.

Features

Glass passivated.
High maximum operating temperature.
Low leakage current.
Excellent stability.
Available in ammo-pack.
Also available with preformed leads for easy insertion.

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Published: Mar 23, 2005 |