NTE424 Datasheet (NTE Electronics) - Non-Silicone Heat Sink Compound

NTE424, Non-Silicone Heat Sink Compound

NTE424 heat sink compound is a grease *like, non *silicone, non *migrating material heavily impregnated with heat *conductive metal oxides.

This formulation provides high thermal conductivity, low bleed and high temperature stability.

NTE424 has been engineered to solve

NTE424 Features

* D Non

* Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C

* In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL

* C

* 47113 & MIS

* 19846 Specif