Datasheet Details
| Part number | NSP1832 |
|---|---|
| Manufacturer | NOVOSENSE |
| File Size | 296.82 KB |
| Description | MEMS Differential Pressure Sensor Die |
| Datasheet |
|
| Part number | NSP1832 |
|---|---|
| Manufacturer | NOVOSENSE |
| File Size | 296.82 KB |
| Description | MEMS Differential Pressure Sensor Die |
| Datasheet |
|
Negative Supply Voltage Negative Supply Voltage Negative Sensor Output Negative Sensor Output Positive Supply Voltage Positive Supply Voltage Substrate Supply Voltage Substrate Supply Voltage Positive Sensor Output Positive Sensor Output 1. All dimensions are in micron.2. Bond pad opening size: 110x110um.3. Bond pad metal: Pt, Thickness: 200nm.Symbol GND GND VoutVoutVDD VDD VSUB VSUB Vout+ Vout+ Value 0V 0V +5V +5V +5V +5V - 1,2 Coordinate X-Axis (µm) 105 305 1345 1545 1545 1345 1145 5
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