Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BC846ALT1/D www.DataSheet4U.com General Purpose Transistors BC846ALT1,BLT1 BC847ALT1,.
Features
* = 150°C
* 25°C 556°C/W = 225 milliwatts
The 556°C/W for the SOT
* 23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from t
Applications
* www. DataSheet4U. com Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
interface between the board and the package. With the correct pad geometry, the packages will self alig