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BCW30LT1 General Purpose Transistors

BCW30LT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BCW29LT1/D General Purpose Transistors PNP Silicon COLLECTOR 3 1 BASE 2 EMITTER BCW29.

BCW30LT1 Features

* the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT
* 23 package, PD can be calculated as follows: PD = TJ(max)
* TA RθJA SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperatu

BCW30LT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
BCW30LT1
Manufacturer
Motorola Inc
File Size
451.62 KB
Datasheet
BCW30LT1_MotorolaInc.pdf
Description
General Purpose Transistors

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