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BCW33LT1 General Purpose Transistor

BCW33LT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BCW33LT1/D General Purpose Transistor NPN Silicon COLLECTOR 3 1 BASE 2 EMITTER Symbol .

BCW33LT1 Features

* d 260°C for more than 10 seconds.
* When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
* After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as th

BCW33LT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
BCW33LT1
Manufacturer
Motorola Inc
File Size
371.12 KB
Datasheet
BCW33LT1_MotorolaInc.pdf
Description
General Purpose Transistor

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General Purpose Transistor Motorola Inc
Motorola Inc BCW33LT1-like datasheet