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BC848CLT1 General Purpose Transistors

BC848CLT1 Description

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BC846ALT1/D General Purpose Transistors BC846ALT1,BLT1 BC847ALT1, COLLECTOR 3 NPN Si.

BC848CLT1 Features

* e of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT
* 23 package. Another alternative would be to use a ceramic substrate or an aluminum core boar

BC848CLT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a

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Datasheet Details

Part number
BC848CLT1
Manufacturer
Motorola Inc
File Size
220.78 KB
Datasheet
BC848CLT1_MotorolaInc.pdf
Description
General Purpose Transistors

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General Purpose Transistors Motorola Inc
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