Datasheet4U Logo Datasheet4U.com

MD5811-D256-V3Q18 - Mobile Diskonchip P3

Download the MD5811-D256-V3Q18 datasheet PDF. This datasheet also covers the MD5811-D256-V3Q18_M variant, as both devices belong to the same mobile diskonchip p3 family and are provided as variant models within a single manufacturer datasheet.

Description

3.

Features

  • High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane operation DMA support MultiBurst operation Turbo operation Unrivaled data integrity with a robust Error Detection Code/Error Correction Code (EDC/ECC) Maximized flash endurance with TrueFFS® 6.1 (and hi.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MD5811-D256-V3Q18_M-Systems.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MD5811-D256-V3Q18
Manufacturer M-Systems
File Size 788.05 KB
Description Mobile Diskonchip P3
Datasheet download datasheet MD5811-D256-V3Q18 Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MD5 SILICON MINI BRIDGE RECTIFIER Rectron Semiconductor
MD5-15120AS-AA-CV DC Motor Transmotec
MD5-1980AS-AA-CV DC Motor Transmotec
MD5-2445AS-BB-C DC Motor Transmotec
MD5-2450AS-AA-C DC Motor Transmotec

Other Datasheets by M-Systems

Part Number Description
MD5811-D256-xxxx Mobile Diskonchip P3

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.datasheet4u.com Mobile DiskOnChip P3 256Mb Flash Disk with M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 Highlights Mobile DiskOnChip™ P3, a member of M-Systems’ DiskOnChip™ family of optimized memory solutions for new-generation mobile handsets, provides high performance and reliability using NAND flash technology. It combines Toshiba’s cutting-edge 0.13 micron NAND flash manufacturing process enhanced for performance and reliability with M-Systems’ x2 technology. Mobile DiskOnChip P3 optimizes real estate and cost structure by incorporating the flash array and an embedded thin controller in a single die. A boot block can be used to boot the OS or initialize the CPU/platform, replacing expensive NOR flash and further reducing memory system costs.
Published: |