Description
Advanced Process Technology Surface Mount (IRFZ46NS) l Low-profile through-hole (IRFZ46NL) l 175°C Operating Temperature l Fast Switching l Fully Aval.
l l
IRFZ46NSPbF IRFZ46NLPbF
HEXFET® Power MOSFET
D
PD - 95158
VDSS = 55V RDS(on) = 0.
Features
* VDD
Re-Applied Voltage Inductor Curent
Body Diode
Forward Drop
Ripple ≤ 5%
ISD
* VGS = 5V for Logic Level Devices Fig 14. For N-Channel HEXFETS
www. irf. com
7
IRFZ46NS/LPbF
D2Pak Package Outline
D2Pak Part Marking Information (Lead-Free)
T H I S IS AN IR F 5 30 S WIT H L OT COD E 8 02 4
Applications
* The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection
