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IRFZ14S Power MOSFET

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Description

www.DataSheet4U.com PD - 9.890A IRFZ14S/L HEXFET® Power MOSFET l l l l l Advanced Process Technology Surface Mount (IRFZ14S) Low-profile through-ho.
Third Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.

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Features

* subject to change without notice. 8/97

Applications

* The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection

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