SIGC158T170R3E Datasheet (Infineon)

SIGC158T170R3E, IGBT

AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Version 2.1 2.2 Subjects (major changes since last revision) Change wafer size to 200 mm Additional basic types L7801M, L7801T, L7801E Published by Infi

SIGC158T170R3E Features

* 1700V Trench & Field Stop technology

* low turn-off losses

* short tail current

* positive temperature coefficient

* easy paralleling This chip is used for:

* power modules Applications:

* drives Chip Type VCE IC Die Size SIGC158T170R3E 1700V 125A 12.57 x 12.57 m