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F3L500R12W3H7_H11 - IGBT

Description

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Features

  • Electrical features - VCES = 1200 V - IC nom = 500 A / ICRM = 1000 A - Ultra fast IGBT chips - Low ind-ucDtievteadilessiganbout hole specification for contacts refer to AN2009-01 chapter 2 - Low sw-itcDhiinagmleotsesress of drill P1,15mm - Low VCE-,saCt opper thickness in hole 25~50um - Suitable Infineon gate drivers can be found under https://www. infineon. com/gdfinder.
  • Mechanical features - 3.2 kV AC 1 minute insulation - High current pin - PressFIT contact technology - Rugge.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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44,43 36,08 32,88 29,68 23,28 20,08 7,28 4,08 0 4,08 7,28 10,48 13,68 16,88 20,08 23,28 29,68 32,88 36,08 44,43 W00211902.04 F3L500R12W3H7_H11 EasyPACK™ module Final datasheet EasyPACK™ module with active "Neutral Point Clamp 2" topology and PressFIT / NTC Features • Electrical features - VCES = 1200 V - IC nom = 500 A / ICRM = 1000 A - Ultra fast IGBT chips - Low ind-ucDtievteadilessiganbout hole specification for contacts refer to AN2009-01 chapter 2 - Low sw-itcDhiinagmleotsesress of drill P1,15mm - Low VCE-,saCt opper thickness in hole 25~50um - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - 3.
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