DF80R07W1H5FP_B11 Datasheet - Infineon

DF80R07W1H5FP_B11 IGBT

DF80R07W1H5FP_B11 EasyPACK™ Modul mit TRENCHSTOP™ 5 H5 und CoolSiC™ Schottky Diode und PressFIT / bereits aufgetragenem Thermal Interface Material EasyPACK™ module with TRENCHSTOP™ 5 H5 and CoolSiC™ Schottky diode and PressFIT / pre-applied Thermal Interface Material J Potentielle Anwendungen Solar Anwendungen Elektrische Eigenschaften CoolSiCTM Schottky Diode Gen 5 Erhöhte Sperrspannungsfestigkeit auf 650V Niederinduktives Design Niedrige Scha.

DF80R07W1H5FP_B11 Features

* CoolSiCTM Schottky diode gen 5

* Increased blocking voltage capability up to 650V

* Low inductive design

* Low switching losses Mechanical Features

* Al2O3 substrate with low thermal resistance

* Integrated NTC temperature sensor

* PressFIT c

DF80R07W1H5FP_B11 Datasheet (681.79 KB)