Datasheet4U Logo Datasheet4U.com

IXGP16N60B2D1 - HiPerFAST IGBTs

Download the IXGP16N60B2D1 datasheet PDF (IXGA16N60B2D1 included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for hiperfast igbts.

Features

  • z Optimized for Low Conduction and Switching Losses z Square RBSOA z Anti-Parallel Ultra Fast Diode z International Standard Packages Advantages z High Power Density z Low Gate Drive Requirement.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IXGA16N60B2D1_IXYSCorporation.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Other Datasheets by IXYS Corporation

Full PDF Text Transcription

Click to expand full text
HiPerFASTTM IGBTs B2-Class High Speed w/ Diode IXGA16N60B2D1 IXGP16N60B2D1 IXGH16N60B2D1 VCES = IC110 = VCE(sat) ≤ tfi(typ) = 600V 16A 1.95V 70ns TO-263 AA (IXGA) Symbol VCES VCGR VGES VGEM IC25 IC110 IF110 ICM SSOA (RBSOA) PC TJ TJM Tstg Md FC TL TSOLD Weight Test Conditions Maximum Ratings TJ = 25°C to 150°C TJ = 25°C to 150°C, RGE = 1MΩ Continuous Transient 600 V 600 V ±20 V ±30 V TC = 25°C (Chip Capability) TC = 110°C TC = 110°C TC = 25°C, 1ms VGE = 15V, TJ = 125°C, RG = 22Ω Clamped Inductive load TC = 25°C 40 A 16 A 11 A 100 A ICM = 32 A VCE ≤ VCES 150 W -55 ... +150 °C 150 °C -55 ... +150 °C Mounting Torque (TO-220 & TO-247) Mounting Force (TO-263) 1.13/10 10..65 / 2.2..14.6 Nm/lb.in. N/lb. Maximum Lead Temperature for Soldering 1.6mm (0.
Published: |