| Part number | HY27US16561M, HY27US08561M |
|---|---|
| Manufacturer | Hynix Semiconductor |
| File Size | 800.75 KB |
| Description | (HY27xSxx561M) 256Mbit (32Mx8bit / 16Mx16bit) NAND Flash |
| Datasheet |
 HY27US08561M_HynixSemiconductor.pdf
|
| Note |
This datasheet PDF includes multiple part numbers: HY27US16561M, HY27US08561M. Please refer to the document for exact specifications by model. |
of Device Operations - /CE Don’t Care Enabled(Disabled) -> Sequential Row Read Disabled(Enabled) (Page23) 1) change FBGA dimension : Thickness : 1.2mm(max) -> 1.0mm(max) 2) Edit Fig.33 read operation with CE don't care 1) Change TSOP1,WSOP1,FBGA package dimension 0.6 - Change TSOP1,WSOP1,FBGA mechanical data - Inches parameter has been excluded from the mechanical data table 1) Change TSOP1, WSOP1, FBGA package dimension 2) Edit TSOP1, WSOP1 package figures 3) Change FBGA package figure Oct.
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