H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR 16GB eNAND (x8) / LPDDR3 16Gb(x32)

Hynix Semiconductor

Description

CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product .
and is subject to change without notice.

📥 Download Datasheet

H9TQ17ABJTMCUR-KTM Datasheet Preview — This datasheet PDF includes multiple part numbers: H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR. Please refer to the document for exact specifications by model.

Datasheet Specifications

Part number: H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR
Manufacturer: Hynix Semiconductor
File Size: 3.45 MB
Datasheet: H9TQ17ABJTMCUR-HynixSemiconductor.pdf
Description: 16GB eNAND (x8) / LPDDR3 16Gb(x32)
Note: This datasheet PDF includes multiple part numbers: H9TQ17ABJTMCUR-KTM, H9TQ17ABJTMCUR.
Please refer to the document for exact specifications by model.

Features

* [ CI-MCP ]
* Operation Temperature - (-25)oC ~ 85oC
* Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ]
* eMMC5.0 compatible (Backward compatible to eMMC4.5)
* Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits -

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H9TQ17ABJTMCUR 16GB eNAND LPDDR3 16Gbx32 Hynix Semiconductor

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