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H9TP32A4GDBCPR 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

H9TP32A4GDBCPR Description

CI-MCP Specification 4GB eNAND (x8) + 4Gb LPDDR2-S4B (x32) This document is a general product .
and is subject to change without notice.

H9TP32A4GDBCPR Features

* [ CI-MCP ]
* Operation Temperature - (-25)oC ~ 85oC
* Package - 162-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR2 S4B ]
* Packaged NAND flash memory with MultiMediaCard interface
* e-NAND system specification, compliant with V4.41
* Ful

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Datasheet Details

Part number
H9TP32A4GDBCPR
Manufacturer
Hynix Semiconductor
File Size
2.66 MB
Datasheet
H9TP32A4GDBCPR-HynixSemiconductor.pdf
Description
4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

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4GB eNAND LPDDR2-S4B 4Gbx32 Hynix Semiconductor
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