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FBM1210 - Multilayer Chip Bead

Download the FBM1210 datasheet PDF. This datasheet also covers the FBM0402 variant, as both devices belong to the same multilayer chip bead family and are provided as variant models within a single manufacturer datasheet.

General Description

HITANO ENTERPRISE CORP.

7F-7, No.

New Taipei City, TAIWAN, R.O.C.

Key Features

  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • A closed circuit formed by internal silver printed layer, acting like a magn.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FBM0402-HITANO.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FBM1210
Manufacturer HITANO
File Size 219.74 KB
Description Multilayer Chip Bead
Datasheet download datasheet FBM1210 Datasheet

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Other Datasheets by HITANO

Part Number Description
FBM1204 Multilayer Chip Bead
FBM1206 Multilayer Chip Bead
FBM1808 Multilayer Chip Bead
FBM1812 Multilayer Chip Bead
FBM0402 Multilayer Chip Bead

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Data Sheet Customer: Product: Multilayer Chip Bead – FBM Series Size : 0402/0603/0805/1204/1206/1210/1808/1812 Issued Date: 30-September-2014 Edition: Ver. 1 Record of change Date Ver. 30-Sep.-2014 1 Description Page HITANO ENTERPRISE CORP. 7F-7, No. 3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C. Tel: +886 2 2299 1331 (Rep.) Fax: +886 2 2298 2466, 2298 2969 Prepared by 30-Sep.-2014 Andy Hsu Checked by 30-Sep.-2014 Hwa Wu Approved by 30-Sep.-2014 Hwa Wu Accepted by (customer) MULTILAYER CHIP BEAD FBM SERIES n Introductions The FBM series chip ferrite devices are categorized as noise limiting for EMI/RFI issue and products.