FBM0402 - Multilayer Chip Bead

Product Overview

HITANO

Datasheet Details

Part number	FBM0402
Manufacturer	HITANO
File Size	219.74 KB
Description	Multilayer Chip Bead
Datasheet	FBM0402 Datasheet
Additional preview pages of the FBM0402 datasheet.

Product details

Description

Page HITANO ENTERPRISE CORP.7F-7, No.3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C.Tel: +886 2 2299 1331 (Rep.) Fax: +886 2 2298 2466, 2298 2969 Prepared by 30-Sep.-2014 Andy Hsu Checked by 30-Sep.-2014 Hwa Wu Approved by 30-Sep.-2014 Hwa Wu Accepted by (customer) MULTILAYER CHIP BEAD FBM SERIES n Introductions The FBM series chip ferrite devices are categorized as noise limiting for EMI/RFI issue and products.These ferrite devices are typically us

Features

Excellent solderability and high heat resistance for either flow or reflow soldering.
A closed circuit formed by internal silver printed layer, acting like a magn.

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Published: Feb 18, 2018 |