Description
DIOTEC ELECTRONICS CORP.18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958 Data Sheet No.BRSB-500-1C 5 AM.
Features
* MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 200 AMPS PEAK
IDEAL FOR PRINTED CIRCU
Applications
* SB5 PACKAGE SHOWN ACTUAL SIZE
C C1
SB506
D1
+
712 AC _
A D
RELIABLE LOW-COST MOLDED PLASTIC CONSTRUCTION
L
RoHS COMPLIANT
MECHANICAL DATA
Case: Molded Epoxy (UL Flammability Rating 94V-0) Terminals: Round silver plated pins Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Marked o