CP225 Datasheet - Central Semiconductor

CP225 Small Signal Transistor

( DataSheet : www.DataSheet4U.com ) PROCESS Small Signal Transistor CP225 Central TM NPN - Amp/Switch Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 28,960 PRINCIPAL DEVICE TYPES 2N2218A 2N2221A EPITAXIAL PLANAR 19.8 x 19.8 MILS 9.5 MILS 4.3 x 4.3 MILS 4.3 x 4.3 MILS Al - 30,000Å Au - 12,000Å 145 Adams Avenue Hauppauge, NY 11.

CP225 Datasheet (276.35 KB)