CP208 Datasheet - Central Semiconductor

CP208 Power Transistor NPN - Amp/Switch Transistor Chip

www.DataSheet4U.com PROCESS Power Transistor CP208 Central TM NPN - Amp/Switch Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 2,630 PRINCIPAL DEVICE TYPES CJD31C MJE182 TIP31C EPITAXIAL BASE 66 X 66 MILS 12.5 ± 1.0 MILS 12 X 24 MILS 11 X 14 MILS Al - 50,000Å Cr/Ni/Ag - 16,000Å BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, N.

CP208 Datasheet (232.58 KB)