RF430F5978 datasheet, system-in-package equivalent, Texas Instruments

Features and benefits

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* True System-In-Package Based On MSP430™ Microcontroller With Sub-1-GHz Transceiver System-On-Chip (SoC) and Additional 3D LF Wake-up and Transponder Interface

Application

intellectual property matters and other important disclaimers. PRODUCTION DATA. RF430F5978 SLAS740A
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Description

The TI RF430F5978 system-in-package adds a 3D low-frequency (LF) wake-up and transponder interface to the CC430 ultra-low-power microcontroller system-on-chip (SoC) with integrated sub-1-GHz RF transceiver. This architecture allows activation and dea.

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