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CPD31X - 10A / 60V Schottky Rectifier Die

Features

  • Low forward voltage at 10 Amps forward current Low reverse leakage current Low profile geometry Metalization suitable for standard die attached technologies Top metalization optimized for solder process (CPD31X) Top metalization optimized for wire bonding (CPD34X) Typical Electrical Characteristics.

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Datasheet Details

Part number CPD31X
Manufacturer centralsemi
File Size 857.75 KB
Description 10A / 60V Schottky Rectifier Die
Datasheet download datasheet CPD31X Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Product Brief CPD31X CPD34X 10A, 60V Schottky Rectifier Die Die Size Die Thickness Die Passivation Anode Bonding Pad Area Top Side Metalization (CPD31X) Top Side Metalization (CPD34X) Back Side Metalization Scribe Alley Width Wafer Diameter Gross Die Per Wafer 85 MILS x 85 MILS 5.9 MILS ±0.8 MILS SiN 78 MILS x 78 MILS Al/Ni/Au - 30,000Å/4,000Å/1,500Å Al - 30,000Å Ti/Ni/Au - 1,600Å/5,550Å/1,500Å 3.
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