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K4A8G165WC - 8Gb C-die DDR4 SDRAM

General Description

5.

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Key Features

  • 5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x16 Package Pinout (Top view): 96ball FBGA Package6 3.2 FBGA Package Dimension (x16)7 4. Input/Output Functional.

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Full PDF Text Transcription for K4A8G165WC (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for K4A8G165WC. For precise diagrams, and layout, please refer to the original PDF.

Rev. 1.5, Apr. 2017 K4A8G165WC 8Gb C-die DDR4 SDRAM x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) 1.2V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHA...

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ompliant) 1.2V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

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