25Q80BWNIL datasheet, memory equivalent, Winbond

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..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC / VSOP 150 / 208-mil ......... 6 3.2 PAD Configuration WSON 6x5-mm, USON 2x3-mm / 4x3-mm .. 6 3.3 Pin Descripti.

Description

......... 5 2. FEATURES ..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC / VSOP 150 / 208-mil ......... 6 3.2 PAD Configuration WSON 6x5-mm, USON 2x3-mm / 4x3-mm .. 6 3.3 Pin Description SOIC / VSOP 150/208-mil, USON 2x3 /4x3-mm, WSON 6x5-m.

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